|
The Most Complete Provider of Hi-Rel Microelectronics, Die & Wafer, and Semiconductor Services.
|
|
|
|
|
|
December 2025 | Year-in-Review As we wrap up another remarkable year, we take a moment to revisit some of the major milestones that have shaped 2025. These include our strategic acquisition of Integra Technologies, the grand opening of our new Hi-Rel DC-DC Power PCB Design & Manufacturing Facility in Denmark, and many new cutting-edge innovations in microelectronic products and services. Join us as we celebrate and look forward to a promising new year filled with opportunities for all of us. Wishing you all a joyful holiday season and a Happy New Year!
|
|
|
|
|
|
|
|
MICROSS ACQUIRES INTEGRA TECHNOLOGIES Expanding the Largest U.S. OSAT Provider
|
|
|
|
|
|
January 15th, 2025 - Micross, a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today closed the acquisition of Integra Technologies, one of the largest U.S. Outsourced Semiconductor Assembly and Test (OSAT) providers of semiconductor back-end services focused on high-reliability applications and end markets. The acquisition of Integra further positions Micross as a leader in United States-based OSAT services and further broadens Micross’ portfolio of high-reliability microelectronic services and products.
|
|
|
|
|
|
|
|
ACQUISITIONS & NEW OPERATIONS Expanding Manufacturing Capabilities Globally
|
|
|
|
|
|
|
|
2 New Facilities with the acquisition of Integra Technologies. Located in Wichita, Kansas & Milpitas, California. January 15th, 2025
|
|
|
1 New Facility in Ballerup, Denmark serving as our center-of-excellence for PCB power converter design & manufacturing. March 11th, 2025
|
|
|
|
|
|
|
|
INDUSTRY LEADERSHIP "Engineer of the Year" Awarded by 3D InCites
|
|
|
|
|
|
|
|
March 4th, 2025 - Rex Anderson, Director of Operations at Micross AIT was awarded with the "Engineer of the Year" Award for going above and beyond to engage with his peers through participation in industry organizations. Rex heads the Secure Center for Advanced Packaging of Excellence (SCAPEx), Micross’ most significant initiative under the DoD RESHAPE program to on-shore 300mm wafer bumping and finishing.
|
|
|
|
|
|
|
|
NEW DENMARK FACILITY Inaugural First Flight Shipment
|
|
|
|
|
|
September 2025 - We’re very proud to celebrate the first Flight Hardware manufactured from our new Hi-Rel Power Solutions facility, located in Denmark, shipped last Month. Production of the First flight Hardware started mid-July and was completed by the end September 2025. This First Flight Hardware product is a Space-grade high-reliability PCB DC-DC converter, utilized in a MILSATCOM system. After delivery, the operations team responsible for this inaugural shipment marked the achievement with a cake celebration! Bravo to the entire team in Denmark!
|
|
|
|
|
|
|
|
|
300mm WAFER PROCESSING DoD Contract Expands Micross OSAT Capabilities
|
|
|
|
|
|
Micross is bringing its 300mm wafer-level advanced packaging capability online at our Advanced Interconnect Technologies (AIT) facility in North Carolina, expanding domestic capacity for secure wafer prep, bumping and advanced interconnect solutions. The IBAS RESHAPE 300mm product line is purpose built to support advanced nodes from foundries, delivering the flexibility, security and technical depth required for high reliability applications. Completed in 2025: - Construction and certification of new and existing cleanroom spaces
- Installation of facility infrastructure and 300mm tooling and equipment, and initial process qualification
Upcoming in 2026: - Completing final tooling qualifications
- Line / capability qualifications
- Preparation for prototypes builds & production ramp-ups
|
|
|
"Our focus is on delivering trusted, domestic 300mm wafer prep and bumping capabilities for advanced high-reliability microelectronics. IBAS gives our customers secure access to modern wafer-level packaging technologies that reduce size, weight, and power while meeting the rigor and mission assurance requirements of the nation’s most critical defense and security programs.” - Chris Celestin, Corporate Program Director at Micross
|
|
|
|
|
|
|
|
|
|
|
|
Chiplets - Optimized Device Integration, SWaP Performance & Time-to-Market - Recorded May 2nd, 2025
|
|
|
|
|
|
|
|
Developing Advanced Packaging Supply Chains for Onshore Microelectronics in Production - Recorded October 2nd, 2025
|
|
|
|
|
|
|
|
Optimizing DC-DC Power Supply for Space & Defense… Balancing Needs, Performance & Budget - Recorded December 4th, 2025
|
|
|
|
|
|
|
|
|
|
EFFICIENT & HIGH-DENSITY POWER SUPPLIES Cost-Effective DC-DC Power for NewSpace
|
|
|
|
|
|
|
|
In the rapidly evolving landscape of NewSpace, efficient power management is crucial for the success of satellite systems and space exploration missions. The integration of Gallium Nitride (GaN) technology into DC-DC power supplies is revolutionizing the industry. GaN-based power supplies deliver superior performance with higher power densities, faster switching speeds, and lower thermal management requirements compared to traditional silicon counterparts. Be on the lookout for our innovative products and developments launching in 2026 that will redefine power performance in this exciting field!
|
|
|
|
|
|
|
|
On behalf of all of us at Micross, we wish you and your family a peaceful holiday season, and a happy new year!
|
|
|
|
|
